creat by art - glass passivated junction - ideal for printed circuit board - high case dielectric strength - typical ir less than 0.1 a - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a i 2 t a 2 s cj pf t j o c t stg o c document number: ds_d1409010 version: h14 typical thermal resistance r jc r ja 4 19 o c/w unit typical junction capacitance per leg 240 maximum instantaneous forward voltage (note 1) i f = 2a i f = 4a v f 1.0 1.1 operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle note 2: measured at 1mhz and applied reverse voltage of 4.0v d.c. v maximum dc reverse current t j =25 o c at rated dc blocking voltage t j =125 o c i r 5 500 a peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 150 a rating for fusing (t<8.3ms) 93 maximum average forward rectified current 4 maximum repetitive peak reverse voltage maximum rms voltage weight: 7.2 g (approximately) maximum ratings and electrical characteristics (t a =25 o c unless otherwise noted) symbol kbu 406g kbu 407g parameter - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec kbu mechanical data case: kbu maximum dc blocking voltage mounting torque: 0.56 nm max. KBU401G thru kbu407g taiwan semiconductor glass passivated brid g e rectifiers features kbu 401g kbu 402g kbu 403g kbu 404g kbu 405g
part no. part no. kbu407g kbu407g (ta=25 unless otherwise noted) document number: ds_d1409010 version: h14 kbu40xg (note 1) t0 note 1: "x" defines voltage from 50v (KBU401G) to 1000v (kbu407g) KBU401G thru kbu407g taiwan semiconductor ordering information packing code packing code suffix ratings and characteristics curves t0 example preferred p/n packing code kbu407g t0 package packing g kbu 500 / tray packing code suffix description kbu407g t0g t0 g green compound 0 1 2 3 4 5 0 20 40 60 80 100 120 140 160 average forward a current (a) case temperature ( o c) fig.1 maximum derating curve for output current resistive or inductiveload with heatsink 0 50 100 150 200 250 300 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum forward surge current per leg 8.3ms single half sine wave 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (v) fig. 3 typical reverse characteristics per leg t j =25 o c t j =125 o c 0.1 1 10 100 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 instantaneous forward current (a) instantaneous forward voltage (v) fig. 4 typical forward characteristics per leg
min max min max a 18.8 19.8 0.740 0.780 b 4.6 5.6 0.181 0.220 c d 1.2 1.3 0.047 0.051 e 20.0 - 0.787 - f 6.8 7.1 0.268 0.280 g 22.7 23.7 0.894 0.933 h 4.6 5.0 0.181 0.197 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1409010 version: h14 kbu marking diagram KBU401G thru kbu407g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 8.2 (typ.) 0.322 (typ.) 10 100 1000 0.1 1 10 100 junction capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vslg=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1409010 version: h14 KBU401G thru kbu407g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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